Interstitial Carbon in Copper: Electronic and Mechanical Properties Academic Article uri icon

abstract

  • The effects of interstitial carbon on the electronic and mechanical properties of copper are studied theoretically. Semiempirical methodology, atomistic simulations, and first-principles density functional embedded cluster schemes are combined to extract some understanding of the diffusion process and related degradation of Cu/C composite materials under extremes of temperature and stress. High-resolution scanning electron microscopy results are presented, which demonstrate the existence of a solid solution zone at the Cu/C interface. * On leave of absence from Inst. de Fsica-UFBa, 40210-340-BRAZIL 2 I. INTRODUCTION Small concentrations of impurities in metals are of recognized importance in controlling their mechanical and electrical properties. In metallic conductors like copper, small particle precipitates are found to improve hardness and wear resistance of contacts. Recently dispersion-strengthened copper alloys based upon fine insoluble particles of composition like Cr 2 Nb ...

publication date

  • February 19, 1980