Molecular Dynamics of Cross-Slip in Copper Conference Paper uri icon


  • The cross slip mechanism in Cu was studied using constant-temperature constant-stress molecular dynamics, by simulating the annihilation process of two parallel dissociated screw dislocations. Both narrow and wide dislocation dipoles were considered. Spontaneous annihilation via the cross slip mechanism was observed for short separation distances between the dislocations. At these low separation distances, when cross-slip didn't occur, a bound metastable state was found for the two dislocations. Annihilation from this metastable state was induced by increasing the temperature. At large separation distances cross-slip was stimulated by applying an external stress, which decreased the dissociation width of the screw dislocations. From the time until cross-slip occurs, which was found to be dependent on both the narrowing stress and the temperature, the activation volume and energy were …

publication date

  • January 1, 2003