The Wetting Issue in B4C-Metal Joining Academic Article uri icon

abstract

  • Boron carbide has attractive properties such as elevated hardness, low density, low thermal conductivity etc. which make it suitable for various applications related to joining technology. The wetting behavior of ceramics by metals is of great importance in conjunction with successful joining. In general, filler metals, based on Cu, Sn, Au and Ag do not wet boron carbide. However, wetting may be improved by active element addition. Active elements like Ti, Al or Si can react with the ceramic substrate, lead to modification of the metal/ceramic interface and to improved wetting. In the present study interface reactions and wetting in the B 4 C/Me systems containing active elements were investigated and characterized. The experimental results are interpreted using a thermodynamic analysis of these multicomponent systems. It was established by sessile drop wetting experiments that pure …

publication date

  • January 1, 2006